HomeToolsTool SetsAMAOE BGA Reballing Stencil Template HI6260 V101 CPU 0.12mm Thickness Magnetic Anti-Drumming Design for Phone Chip Repair
AMAOE BGA Reballing Stencil Template HI6260 V101 CPU 0.12mm Thickness Magnetic Anti-Drumming Design for Phone Chip Repair

AMAOE BGA Reballing Stencil Template HI6260 V101 CPU 0.12mm Thickness Magnetic Anti-Drumming Design for Phone Chip Repair

| 1 Ratings
$0.99-77%
$4.25

Metal BGA stencil for HI6260 V101 CPU reballing with 0.12mm thickness and magnetic design to prevent movement during soldering. Suitable for mobile phone chip repair and electronics maintenance.

Total Sold:2
Stock:198
Wishlist:0
High-concerned chemical:None
Material:Metal
Type:Combination
Origin:Mainland China
Brand Name:oneten
DIY Supplies:Electrical
1
No description available.