AMAOE BGA Reballing Stencil Template HI6260 V101 CPU 0.12mm Thickness Magnetic Anti-Drumming Design for Phone Chip Repair
| 1 Ratings
$0.99-77%
$4.25
Metal BGA stencil for HI6260 V101 CPU reballing with 0.12mm thickness and magnetic design to prevent movement during soldering. Suitable for mobile phone chip repair and electronics maintenance.
Total Sold:2
Stock:198
Wishlist:0
High-concerned chemical:None
Material:Metal
Type:Combination
Origin:Mainland China
Brand Name:oneten
DIY Supplies:Electrical
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No description available.
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